LMZ31520RLGT compatible with standard QFN mounting and testing techniques.

LMZ31520RLGT  3V to 14.5V, 20A Step-Down Power Module in 15x16x5.8mm QFN Package

The LMZ31520 power module is an easy-to-use integrated power solution that combines a20-A DC/DC converter with power MOSFETs, a shielded inductor, and passives into a low profile, QFNpackage. This total power solution allows as few as three external components and eliminates theloop compensation and magnetics part selection process. The 15×16×5.8 mm QFN package is easy to solder onto a printed circuit board and allows acompact point-of-load design. Achieves greater than 95% efficiency, has ultra-fast load stepresponse and excellent power dissipation capability with a thermal impedance of 8.6°C/W. TheLMZ31520 offers the flexibility and the feature-set of a discrete point-of-load design and is idealfor powering a wide range of ICs and systems. Advanced packaging technology affords a robust andreliable power solution compatible with standard QFN mounting and testing techniques.

Products Details

●Complete Integrated Power Solution; Smaller than a Discrete Design

●15 mm × 16 mm × 5.8 mm Package Size - Pin Compatible with LMZ31530

●Ultra-Fast Load Step Response

●Efficiencies Up To 96%

●Wide-Output Voltage Adjust 0.6 V to 3.6 V, with 1% Reference Accuracy

●Optional Split Power Rails Allows Input Voltage Down to 3 V

●Selectable Switching Frequency (300 kHz to 850 kHz)

●Selectable Slow-Start

●Adjustable Overcurrent Limit

●Power Good Output

●Output Voltage Sequencing

●Over Temperature Protection

●Pre-bias Output Start-up

●Operating Temperature Range: –40°C to 85°C

●Enhanced Thermal Performance: 8.6°C/W

●Meets EN55022 Class A Emissions - Integrated Shielded Inductor

●Create a Custom Design Using the LMZ31520 With the WEBENCH® Power Designer

The LMZ31520 power module is an easy-to-use integrated power solution that combines a20-A DC/DC converter with power MOSFETs, a shielded inductor, and passives into a low profile, QFNpackage. This total power solution allows as few as three external components and eliminates theloop compensation and magnetics part selection process.

The 15×16×5.8 mm QFN package is easy to solder onto a printed circuit board and allows acompact point-of-load design. Achieves greater than 95% efficiency, has ultra-fast load stepresponse and excellent power dissipation capability with a thermal impedance of 8.6°C/W. TheLMZ31520 offers the flexibility and the feature-set of a discrete point-of-load design and is idealfor powering a wide range of ICs and systems. Advanced packaging technology affords a robust andreliable power solution compatible with standard QFN mounting and testing techniques.

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